Grain depth-of-cut, which is the predominant factor determining the surface morphology, grinding force, and subsurface damage, has a significant impact on the surface quality of the finished part made of hard and brittle materials. When the existing analytical models are used to predict the gain depth-of-cut in ultra-precision grinding process of …
In this study, a novel approach of high speed scratching at the nanoscale depth of cut is developed, using three single-point diamond tips with a sub-micron radius. The fundamental mechanisms...
A novel SiC and CeO2 vitrified #10000 diamond wheel was developed, and three various nanogrinding conditions on silicon wafers were conducted.
A novel ceramic bond ultrafine diamond wheel was developed to acquire nanoscale chips for face nanogrinding. The ceramic bond consists of silicon carbide, alumina, silica, sodium chloride, and sodium bicarbonate. Damage-free subsurfaces of soft-brittle mercury cadmium telluride films were obtained directly by face nanogrinding …
Phase transformation of single crystal silicon induced by grinding with ultrafine diamond grits. Zhenyu Zhang Yueqin Wu D. Guo Han Huang. Materials Science ... Nanocrystalline deformed layers were generated in cadmium zinc telluride (CZT) single crystals by nanogrinding using three different grit sizes. The mechanical properties of …
Face nanogrinding was conducted on HgCdTe films using a novel ultrafine diamond wheel that we have developed. Damage-free subsurface was achieved after direct face nanogrinding. Two undeformed nanometer chips with rectangular cross-section were observed.
Request PDF | On Jan 31, 2011, Zhenyu Zhang and others published Grinding of silicon wafers using an ultrafine diamond wheel of a hybrid bond material | Find, read and cite all the research you ...
The ultra-fine diamond abrasives in the polishing tool demonstrate good dispersion properties and centralized distribution. SiC wafer with a smooth surface and nanoscale roughness (4.3 nm) is achieved after processing by the ultra-fine diamond abrasive polishing tool. In addition, no obvious shedding of the coating can be …
Nanogrinding of SiC wafers with high flatness and low subsurface damage was proposed and nanogrinding experiments were carried out on an ultra precision grinding machine with fine diamond wheels.
DOI: 10.1016/S1003-6326(11)61566-5 Corpus ID: 54775645; Nanogrinding of SiC wafers with high flatness and low subsurface damage @article{Huo2012NanogrindingOS, title={Nanogrinding of SiC wafers with high flatness and low subsurface damage}, author={Fengwei Huo and Dongming Guo and Renke …
Nanogrinding was conducted on soft-brittle cadmium zinc telluride (CdZnTe or CZT) wafers using a ceramic bond ultrafine diamond wheel. Surface roughness R a and PV achieved by nanogrinding are 1.5 ...
A novel ceramic bond ultrafine diamond wheel was developed to acquire nanoscale chips for face nanogrinding. The ceramic bond consists of silicon carbide, alumina, silica, sodium chloride, and ...
To enhance the quality of the grinding surface and reduce the time and cost of polishing, a grind-polishing wheel with a different structure from the conventional diamond wheel was developed. This wheel utilized ultrafine zirconia with grit size of 200 nm as abrasives and nonwoven as substrate to support the abrasives.
Nanogrinding experiments on soft–brittle monocrystalline mercury cadmium telluride (HgCdTe, MCT) were conducted using a novel developed ceramic bond ultrafine diamond grinding wheel.
Nanometer chips were directly fabricated using face nanogrinding carried out by ultrafine diamond grits at room temperature. Direct evidence for ground nanometer …
Crystalline nanoparticles of silicon (Si) were achieved by face nanogrinding with ultrafine diamond grits in deionized water at room temperature. Si nanoparticles …
The maximum undeformed chip thickness ranged from 9.6 to 25.5 nm, as shown in Table 2, which is consistent with the previous reports for the nanogrinding conducted by ultrafine diamond grits [14 ...
In this study, we report our recent results on direct experimental evidence of chips, as well as material removal mechanism of soft-brittle MCT semiconductors …
Semantic Scholar extracted view of "Nanogrinding induced surface and deformation mechanism of single crystal β-Ga 2 O 3" by Shang Gao et al. ... β-Ga2O3 wafer was investigated upon diamond sawing into pieces measuring 2.5 × 3 mm2. ... Influence of stacking-fault energy on microstructural characteristics of ultrafine-grain …
DOI: 10.1016/J.SCRIPTAMAT.2012.04.017 Corpus ID: 135603620; A novel model for undeformed nanometer chips of soft-brittle HgCdTe films induced by ultrafine diamond grits @article{Zhang2012ANM, title={A novel model for undeformed nanometer chips of soft-brittle HgCdTe films induced by ultrafine diamond grits}, author={Zhenyu Zhang …
A novel ceramic bond ultrafine diamond wheel was developed to acquire nanoscale chips for face nanogrinding. The ceramic bond consists of silicon carbide, alumina, silica, sodium chloride, and ...
Nanometer chips were directly fabricated using face nanogrinding carried out by ultrafine diamond grits at room temperature. Direct evidence for ground nanometer chips is cuboid, and the average ratio of width to thickness is 1.49. Chips of 9.0 nm in thickness, 13.3 nm in width, and 16.0 in diagonal were achieved and confirmed using …
A model for wafer rotational nanogrinding of soft-brittle CdZnTe wafers Hongxiu Zhou & Shuo Qiu & Chunmei Wang Received: 16 February 2013/Accepted: 26 July 2013/Published online: 14 August 2013 ... grit size of 900 nm. The concentration of diamond within the ultrafine wheel is 200, corresponding to a volume fraction of 50 %. The wheel consisted ...
A novel ceramic bond ultrafine diamond wheel was developed to acquire nanoscale chips for face nanogrinding. The ceramic bond consists of silicon carbide, alumina, silica, sodium chloride, and ...
Nanogrinding was conducted on soft-brittle cadmium zinc telluride (CdZnTe or CZT) wafers using a ceramic bond ultrafine diamond wheel. Surface roughness Ra and PV achieved by nanogrinding are 1.5 and … Expand
The nanocrystal layer was thinner when the diamond grit size being used was smaller. Download ... The deformation of β-Ga 2 O 3 under nanogrinding was characterised by the occurrence of crystallite ... Phase transformation of single crystal silicon induced by grinding with ultrafine diamond grits. Scr. Mater., 64 (2011), pp. 177 …
Nanogrinding experiments on soft–brittle monocrystalline mercury cadmium telluride (HgCdTe, MCT) were conducted using a novel developed ceramic bond ultrafine diamond grinding wheel. The experimental results showed that the ultrafine grinding wheel exhibited excellent grinding performance on HgCdTe wafers. Surface …
Nanometer chips were directly fabricated using face nanogrinding carried out by ultrafine diamond grits at room temperature. Direct evidence for ground nanometer chips is …
Konik Kırıcı Satın Al. nanogrinding and ultrafine diamond grit - happypuppy.waw.pl The maximum undeformed chip thickness ranged from 9.6 to 25.5 nm, as shown in Table 2, which is consistent with the previous reports for the nanogrinding conducted by ultrafine diamond grits [14, 15, 18 – 21].
7.5.1 Analysis of Nanogrinding Grains. Diamond grains are blocky in nature and possess sharp cutting points prior to nanogrinding workpiece materials. Figure 7.7 shows a collection of diamond abrasive grains that have well defined cutting points that form a wedge at their apex. When bonded into a strong matrix, these grains can be …